Refurbished Gasonics L3510 for plasma asher

Refurbished Gasonics L3510

Manufacture:Gasonics Refurbished by:Allwin21 Corp Gasonics is a Registered Trademark of Novellus Corp.The Gasonics L3510 is a versatile downstream photoresist removal system,designed for clean, damage-free removal of the most difficult resist structures.Utilizing the production-proven L-Series platform, the L3510 has a wide process window due to its patented microwave plasma source.Programmable heating and process controls contribute to the systems’ unparalleled process flexibility.3”, 4”, 5”, 6” and 8”wafer capability. ______________________________________________________________ Allwin21 Corp. can also provide advanced Equip Robot transfer wafer technology ,AW Control Software and Superior Temperature Control Technology to upgrade the refurbished Gasonics L3510 which provides the following significant advantages. Use Equip robot wafer transfer instead of the Frog robot of the original, which will decrease the down time and low the wafer damage, particles greatly. Pentium PC computer equipped with DOS Windows. Interface control board with parallel connectors between PC computer and the Aura-3000 system New 16 bits A/D measurement system to replace original 12 bits A/D system to improve the accuracy of the measurements of gas flow, vacuum pressure, EOP, temperature of the wafer, etc. to improve the repeatability of the Asher process. New 14 bits D/A system to replace original old 8 bits D/A to improve the accuracy of the set point of the vacuum pressure, gas flow, etc. Add new RTP system to get more accuracy temperature control to improve the repeatability of the process. User-friendly recipe editor with gas flow set point, vacuum pressure set point, RF on or off set up, temperature setup etc. New GUI interface with curves display of the temperature, vacuum pressure, gas flow, RF status, EOP signal etc. during the process. Saved all process data on the local hard disk and send data to the server if it is needed (option). Saved all operation function, date, time and error message on the lot file. Wafer ID reading function to read wafer ID and use the wafer ID for the data ID to save the process data. Data saved with 4 layers: (1) directory (say year 2003,2004), (2) lot ID, (3) Date Time or step ID, (4) wafer ID. So it is easy to trace the data. Manual and auto process running. System diagnostics for the quick diagnostic of the system Easier I/O set and checks function for the Maintenance. Higher through put. Advanced accurate temperature control to make much better repeatability. All process data saved and easier for failure analyzer and process debug. “Exposed” I/O, A/D, D/A is easier for troubleshooting and maintenance. Tools would be painted and cleaned up Chamber would be re-anodized . The frame would be re-painted.

In semiconductor manufacturing plasma asher/stripper is the process of removing the photoresist from an etched wafer. Using a plasma source, a monatomic reactive species is generated. Oxygen or fluorine are the most common reactive species. The reactive species combines with the photoresist to form ashing which is removed with a vacuum pump.

Typically, monatomic (single atom) oxygen plasma is created by exposing oxygen gas (O2) to ionizing radiation. At the same time, many free radicals are formed which could damage the wafer. Newer, smaller circuitry is increasingly susceptible to these particles. Originally, plasma was generated in the process chamber, but as the need to get rid of free radicals has increased, many machines now use a downstream plasma configuration, where plasma is formed remotely and channeled to the wafer. This allows electrically charged particles time to recombine before they reach the wafer surface, and prevents damage to the wafer surface.

Monatomic oxygen is electrically neutral and although it does recombine during the channeling, it does so at a slower rate than the positively or negatively charged free radicals, which attract one another. Effectively, this means that when all of the free radicals have recombined, there is still a portion of the active species available for process. Because a large portion of the active specie is lost to recombination, process times may take longer. To some extent, these longer process times can be mitigated by increasing the temperature of the reaction area.

Allwin21 Corp can provide the following refurbished plasma asher/descum equipment.

• Refurbished Matrix 105
• Refurbished Matrix 205
• Refurbished Matrix 10
• Refurbished Gasonics Aura 1000
• Refurbished Gasonics Aura 2000
• Refurbished Gasonics Aura 3010
• Refurbished Gasonics L3510
• Refurbished Branson IPC 3000
• Refurbished Branson IPC L3200

Gasonics Aura 1000 Gasonics Aura 3010Gasonics Aura 2000LLGasonics L3510

Branson IPC L3200Branson IPC 3000 Matrix 105Matrix 10

Allwin21 Corp. can also provide Allwin21 Corp proprietary AW Control Software and Superior Temperature Control Technology to upgrade the refurbished equipment which provides the following significant advantages